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ams
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W71NW10GE3FW
W71NW10GE3FW
Part Number:
W71NW10GE3FW
SKU:
137964
Manufacturer:
Winbond
Description:
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Rohs State:
Need to verify
Free Sample Request:
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Availability:
56828 in stock
Delivery Date:
4-7 days
Call for pricing
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Specifications
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Products specifications
Manufacturer(MFG)
Winbond
Part Category
Multichip Packages
RoHS
RoHS Compliance
Type
NAND Flash, LPDDR2
Memory Size
1 Gbit, 512 Mbit
Series
W71NW10GE
Mounting Type Style
SMD/SMT
Clock Frequency(Max)
29 MHz, 400 MHz
Operating Temperature(Min)
- 40 C
Operating Temperature(Max)
+ 85 C
Brand
Winbond
Data Bus Width
8 bit, 32 bit
Moisture Sensitive
Yes
Organization
128 M x 8, 16 M x 32
Product
NAND-Based MCP
Product Type
Multichip Packages
Standard Pack Quantity
2000
Product Group
Memory & Data Storage
Supply Voltage(Max)
1.95 V
ECCN
EAR99
Supply Voltage(Min)
1.7 V
USHTS
8542320051
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W71NW10GE3FW
Multichip Packages
W71NW10GE3FW
Winbond
Products specifications
Manufacturer(MFG)
Winbond
Part Category
Multichip Packages
RoHS
RoHS Compliance
Type
NAND Flash, LPDDR2
Memory Size
1 Gbit, 512 Mbit
Series
W71NW10GE
Mounting Type Style
SMD/SMT
Clock Frequency(Max)
29 MHz, 400 MHz
Operating Temperature(Min)
- 40 C
Operating Temperature(Max)
+ 85 C
Brand
Winbond
Data Bus Width
8 bit, 32 bit
Moisture Sensitive
Yes
Organization
128 M x 8, 16 M x 32
Product
NAND-Based MCP
Product Type
Multichip Packages
Standard Pack Quantity
2000
Product Group
Memory & Data Storage
Supply Voltage(Max)
1.95 V
ECCN
EAR99
Supply Voltage(Min)
1.7 V
USHTS
8542320051
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