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Part Number: W71NW10GE3FW
SKU: 137964
Manufacturer: Winbond
Description: Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Rohs State: Need to verify
Free Sample Request: Request Free Samples
Availability: 56828 in stock
Delivery Date: 4-7 days
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Products specifications
Manufacturer(MFG) Winbond
Part Category Multichip Packages
RoHS RoHS Compliance
Type NAND Flash, LPDDR2
Memory Size 1 Gbit, 512 Mbit
Series W71NW10GE
Mounting Type Style SMD/SMT
Clock Frequency(Max) 29 MHz, 400 MHz
Operating Temperature(Min) - 40 C
Operating Temperature(Max) + 85 C
Brand Winbond
Data Bus Width 8 bit, 32 bit
Moisture Sensitive Yes
Organization 128 M x 8, 16 M x 32
Product NAND-Based MCP
Product Type Multichip Packages
Standard Pack Quantity 2000
Product Group Memory & Data Storage
Supply Voltage(Max) 1.95 V
ECCN EAR99
Supply Voltage(Min) 1.7 V
USHTS 8542320051
Products specifications
Manufacturer(MFG) Winbond
Part Category Multichip Packages
RoHS RoHS Compliance
Type NAND Flash, LPDDR2
Memory Size 1 Gbit, 512 Mbit
Series W71NW10GE
Mounting Type Style SMD/SMT
Clock Frequency(Max) 29 MHz, 400 MHz
Operating Temperature(Min) - 40 C
Operating Temperature(Max) + 85 C
Brand Winbond
Data Bus Width 8 bit, 32 bit
Moisture Sensitive Yes
Organization 128 M x 8, 16 M x 32
Product NAND-Based MCP
Product Type Multichip Packages
Standard Pack Quantity 2000
Product Group Memory & Data Storage
Supply Voltage(Max) 1.95 V
ECCN EAR99
Supply Voltage(Min) 1.7 V
USHTS 8542320051
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